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Lab Technician


This is a Full-time position in Chandler, AZ posted October 28, 2021.

  • The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
  • Minimum qualification is an AA degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.
  • Knowledge of packaging material property and behavior is beneficial.
    Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized.
  • Preferred skills:
    Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM imaging on printed circuit board are preferred.

Imaging,Optical microscopy,X-section,printed circuit